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dc.contributor.authorKushvaha, Saroj Kumar
dc.contributor.authorKallenbach, Paula
dc.contributor.authorGorantla, Sai Manoj N. V. T.
dc.contributor.authorHerbst-Irmer, Regine
dc.contributor.authorStalke, Dietmar
dc.contributor.authorRoesky, Herbert W.
dc.date.accessioned2024-02-09T11:56:44Z
dc.date.available2024-02-09T11:56:44Z
dc.date.issued2023-11-07
dc.description.abstractHerein, we report the synthesis of a rare bis-silylene, 1, in which two Si<sup>II</sup>atoms are bridged by a Si<sup>IV</sup> atom. Compound 1 contains an unusual Si<sup>II</sup> SiI<sup>V</sup> Si<sup>II</sup> bonding arrangement with Si<sup>II</sup> Si<sup>IV</sup> bond distances of 2.4212(8) and 2.4157(7) Å. Treatment of 1 with Fe(CO)<sub>5</sub> afforded a dinuclear Fe<sup>0</sup>S complex 2 with two unusually long Si Si bonds (2.4515(8) and 2.4488(10) Å). We have also carried out a detailed computational study to understand the nature of the Si Si bonds in these compounds. Natural bond orbital (NBO) and energy decomposition analysis–natural orbital for chemical valence (EDA-NOCV) analyses reveal that the Si Si bonds in 1 and 2 are of an electron-sharing nature.en_US
dc.identifier.citationKushvaha, Kallenbach, Gorantla, Herbst-Irmer, Stalke, Roesky. Preparation of a Compound with a Si<sup>II</sup>−Si<sup>IV</sup>−Si<sup>II</sup> Bonding Arrangement. Chemistry - A European Journal. 2023en_US
dc.identifier.cristinIDFRIDAID 2242559
dc.identifier.doi10.1002/chem.202303113
dc.identifier.issn0947-6539
dc.identifier.issn1521-3765
dc.identifier.urihttps://hdl.handle.net/10037/32893
dc.language.isoengen_US
dc.publisherWileyen_US
dc.relation.journalChemistry - A European Journal
dc.rights.accessRightsopenAccessen_US
dc.rights.holderCopyright 2023 The Author(s)en_US
dc.rights.urihttps://creativecommons.org/licenses/by/4.0en_US
dc.rightsAttribution 4.0 International (CC BY 4.0)en_US
dc.titlePreparation of a Compound with a SiII−SiIV−SiII Bonding Arrangementen_US
dc.type.versionpublishedVersionen_US
dc.typeJournal articleen_US
dc.typeTidsskriftartikkelen_US
dc.typePeer revieweden_US


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Attribution 4.0 International (CC BY 4.0)
Except where otherwise noted, this item's license is described as Attribution 4.0 International (CC BY 4.0)