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dc.contributor.authorAhmad, Tanveer
dc.contributor.authorXue, Hui
dc.contributor.authorKhawaja, Hassan Abbas
dc.contributor.authorSun, Zhiheng
dc.contributor.authorLinmei, Nie
dc.contributor.authorMoatamedi, Mojtaba
dc.date.accessioned2017-01-24T10:03:39Z
dc.date.available2017-01-24T10:03:39Z
dc.date.issued2016-12-08
dc.description.abstractThis study proposes to determine the thermal conductivity of SK One Component Polyurethane (SKOCP) developed by China Institute of Water Resources & Hydropower Research Beijing IWHR-KHL Co. Ltd. SKOCP provides excellent proof of aging and chemical resistance of this material. It is non-toxic, acts as a good anti-seepage, offers anti-abrasion and good anti-freezing performance. In addition, it has high strength, high elongation and good bonding with base materials (i.e. concrete, metal surfaces, etc.).With all these robust properties, the one component polyurethane seems the most favourable material for construction in cold regions as it acts as anti-freezing and protects against freeze-thaw fractures. The research aims to study SKOCP in depth and to determine its thermal conductivity using experimentations and multiphysics based numerical simulations. The standard experimental setup, as suggested by Kvadsheim, Folkow et al. (1994), will be used to determine the thermal conductivity. In addition, infrared imaging technique will also be employed to study the thermal profiles, which will be used to estimate the thermal conductivity (Rashid, Khawaja et al. 2016). The thermal data will be compared against the multiphysics numerical simulation results. The study will help in building the confidence between the experimentation and multiphysics based numerical studies and provide scientific background for application of SKOCP in the Cold Climate.en_US
dc.descriptionPoster presented at The International Conference of Multiphysics. Arranged by The International Society of Multiphysics, in Zurich, 08.12.16 - 09.12.16.en_US
dc.identifier.cristinIDFRIDAID 1404251
dc.identifier.urihttps://hdl.handle.net/10037/10202
dc.language.isoengen_US
dc.rights.accessRightsopenAccessen_US
dc.subjectVDP::Teknologi: 500::Materialteknologi: 520en_US
dc.subjectVDP::Technology: 500::Materials science and engineering: 520en_US
dc.titleThermal Properties of SK One Component Polyurethane using Experiments and Multiphysics Simulationsen_US
dc.typeConference objecten_US
dc.typeKonferansebidragen_US


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